Title:
RESIN FILM, METHOD FOR PRODUCING SAME, PRINTED WIRING BOARD, COVERLAY, AND MULTILAYER BODY
Document Type and Number:
WIPO Patent Application WO/2021/256340
Kind Code:
A1
Abstract:
The present invention provides: a resin film which is produced from a polyarylene ether ketone resin and has improved thermal dimensional stability without deteriorating heat resistance and low dielectric characteristics, while being suppressed in increase of the relative dielectric constant or tanδ due to high humidity; a method for producing this resin film; a printed wiring board; a coverlay; and a multilayer body. A resin film 2 which is used for a printed wiring board 1 or the like and contains a polyarylene ether ketone resin, a fluorine-based resin and a synthetic mica, wherein: the total content of the polyarylene ether ketone resin and the fluorine-based resin is set to 100 parts by mass; the content of the synthetic mica is set to a value from 10 parts by mass to 80 parts by mass; the mass ratio of the polyarylene ether ketone resin to the fluorine-based resin, namely (polyarylene ether ketone resin)/(fluorine-based resin) is set to a value from 98/2 to 50/50; and the relative crystallinity of the polyarylene ether ketone resin is set to 80% or higher.
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Inventors:
KOIZUMI AKIHIRO (JP)
KATAGIRI WATARU (JP)
GONDA TAKASHI (JP)
KATAGIRI WATARU (JP)
GONDA TAKASHI (JP)
Application Number:
PCT/JP2021/021901
Publication Date:
December 23, 2021
Filing Date:
June 09, 2021
Export Citation:
Assignee:
SHINETSU POLYMER CO (JP)
International Classes:
B32B27/00; B32B15/082; B32B27/18; B32B27/30; C08J5/18; C08K3/34; C08L27/12; C08L71/08; H05K3/28
Domestic Patent References:
| WO2006006508A1 | 2006-01-19 | |||
| WO2013125468A1 | 2013-08-29 |
Foreign References:
| JP2006274073A | 2006-10-12 | |||
| JP2020021626A | 2020-02-06 | |||
| JP2020089994A | 2020-06-11 | |||
| JP2019034392A | 2019-03-07 | |||
| JP2014224249A | 2014-12-04 |
Attorney, Agent or Firm:
FUJIMOTO Eisuke et al. (JP)
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