RESIN LAMINATE AND CARD COMPRISING RESIN LAMINATE

Title:

RESIN LAMINATE AND CARD COMPRISING RESIN LAMINATE

Document Type and Number:

WIPO Patent Application WO/2018/163889

Kind Code:

A1

Abstract:

The present invention enables the achievement of: a resin laminate which has high durability, high heat resistance and excellent easy processability, while maintaining transparency; and a card which comprises a resin laminate. The above-described problem is solved by a resin laminate according to the present invention, which is obtained by laminating a plurality of resin sheets, and wherein the outermost resin sheet that constitutes the outermost layer of the resin laminate contains a polycarbonate resin (A) that has a viscosity average molecular weight of from 30,000 to 60,000 (inclusive).

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Inventors:

SUZUKI KENTARO (JP)
TAKEDA MASAHIDE (JP)
ASANO JUNYA (JP)

Application Number:

PCT/JP2018/006999

Publication Date:

September 13, 2018

Filing Date:

February 26, 2018

Export Citation:

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Assignee:

MITSUBISHI GAS CHEMICAL CO (JP)
MGC FILSHEET CO LTD (JP)

International Classes:

B32B27/36; B42D25/30

Domestic Patent References:

WO2015093516A1

2015-06-25

Foreign References:

JP2015104910A	2015-06-08
JP2010194757A	2010-09-09
JP2014124854A	2014-07-07
JP2012068381A	2012-04-05
JP4281554B2	2009-06-17
JP2004017614A	2004-01-22
JP2002097361A	2002-04-02

Other References: