Title:
RESIN LAMINATE AND METHOD OF MANUFACTURING RESIN LAMINATE
Document Type and Number:
WIPO Patent Application WO/2019/244395
Kind Code:
A1
Abstract:
To provide a resin laminate that has excellent moldability and a method of manufacturing the resin laminate, the present invention is characterized by having a thermoplastic resin layer in tight contact between two arbitrary thermosetting resin layers. The present invention is also characterized in that, in at least one of the thermosetting resin layers, the molecules making up the thermosetting resin have dynamic covalent bonds which are covalent bonds that can reversibly break and reform. The present invention is further characterized in that at least one of the thermosetting resin layers is a fiber-containing thermosetting resin.
Inventors:
KAGAWA HIROYUKI (JP)
KONDO TAKESHI (JP)
KONDO TAKESHI (JP)
Application Number:
PCT/JP2019/005319
Publication Date:
December 26, 2019
Filing Date:
February 14, 2019
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
B32B27/08; B32B5/28
Domestic Patent References:
| WO2016132655A1 | 2016-08-25 | |||
| WO2015122485A1 | 2015-08-20 |
Foreign References:
| JP2014061640A | 2014-04-10 | |||
| JP2002105223A | 2002-04-10 | |||
| JPH04250033A | 1992-09-04 | |||
| EP2784106A1 | 2014-10-01 |
Attorney, Agent or Firm:
ISONO INTERNATIONAL PATENT OFFICE, P.C. (JP)
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