Title:
RESIN LAYER, GREASE COMPOSITION, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/018978
Kind Code:
A1
Abstract:
Provided are: a resin layer having superior performance; a grease composition suitable for forming said resin layer; and an electronic device including said resin layer or a layer obtained from said grease composition. One aspect of the present invention is a resin layer containing: a resin; and a filler that contains first particles comprising a plurality of SiC particles and second particles comprising a plurality of particles other than SiC. In a cross-section of the resin layer, when the area ratio occupied by the first particles is defined as a first particle distribution ratio Dp1, and the area ratio occupied by the second particles is defined as a second particle distribution ratio Dp2, the first particle distribution ratio Dp1 is 30.0-70.0%, the second particle distribution ratio Dp2 is 10.0-40.0%, and the sum [Dp1+Dp2] of the first particle distribution ratio Dp1 and the second particle distribution ratio Dp2 is 60.0-90.0%.
Inventors:
HATTORI TAKUMA (JP)
Application Number:
PCT/JP2023/025824
Publication Date:
January 25, 2024
Filing Date:
July 13, 2023
Export Citation:
Assignee:
TOMOEGAWA CO LTD (JP)
International Classes:
C08L101/00; C08K3/22; C08K3/34; C08L83/04; C09K5/14; H01L23/00; H01L23/36; H01L23/373; H05K7/20; H05K9/00
Foreign References:
| JP2021034637A | 2021-03-01 | |||
| JP2003183498A | 2003-07-03 | |||
| JP2006111644A | 2006-04-27 | |||
| JP2017137454A | 2017-08-10 | |||
| JP2009102577A | 2009-05-14 |
Attorney, Agent or Firm:
ITOH, Atsushi et al. (JP)
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