Title:
RESIN MATERIAL FOR FORMING UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD FOR PRODUCING RESIST UNDERLAYER FILM, AND LAYERED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2019/069502
Kind Code:
A1
Abstract:
This resin material for forming an underlayer film is used for forming a resist underlayer film used in a multilayer resist process, contains a cyclic olefin polymer (I), and is such that when the resin material for forming an underlayer film is measured using a rheometer in a shear mode in a nitrogen atmosphere at a measurement temperature range of 30-300ºC, a temperature increase rate of 3ºC/min, and a frequency of 1 Hz, the temperature at which the storage elastic modulus (G') curve and loss elastic modulus (G'') curve of solid viscoelasticity intersect is 40-200°C.
Inventors:
KAWASHIMA KEISUKE (JP)
ODA TAKASHI (JP)
INOUE KOJI (JP)
ODA TAKASHI (JP)
INOUE KOJI (JP)
Application Number:
PCT/JP2018/020785
Publication Date:
April 11, 2019
Filing Date:
May 30, 2018
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
G03F7/11; C08G61/00
Domestic Patent References:
| WO2009008446A1 | 2009-01-15 |
Foreign References:
| JP2008026600A | 2008-02-07 | |||
| JP2014174428A | 2014-09-22 | |||
| JP2004177668A | 2004-06-24 | |||
| JP2017196452A | 2017-11-02 |
Other References:
See also references of EP 3693793A4
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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