Title:
RESIN MATERIAL AND MULTILAYER PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2021/182207
Kind Code:
A1
Abstract:
Provided is a resin material that can effectively remove smears using de-smear treatment, reduce the dielectric loss tangent of a cured product, and increase the thermal dimensional stability of a cured product. The resin material according to the present invention comprises a first compound having a first skeleton and a curing accelerator, wherein the first skeleton is derived from an acid anhydride having a non-conjugate carbon-carbon double bond and has an imide bond.
Inventors:
KAWAHARA YUKO (JP)
HAYASHI TATSUSHI (JP)
KAMAGA KEI (JP)
HAYASHI TATSUSHI (JP)
KAMAGA KEI (JP)
Application Number:
PCT/JP2021/008066
Publication Date:
September 16, 2021
Filing Date:
March 03, 2021
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08F299/00; C08G59/40; C08G73/10; C08L63/00; C08L79/08; H05K1/03; H05K3/46
Domestic Patent References:
| WO2016171101A1 | 2016-10-27 | |||
| WO2001010964A1 | 2001-02-15 | |||
| WO2020203834A1 | 2020-10-08 | |||
| WO2021020563A1 | 2021-02-04 |
Foreign References:
| JP2005330356A | 2005-12-02 | |||
| JPS63312321A | 1988-12-20 | |||
| JP2009155640A | 2009-07-16 | |||
| JP2021025051A | 2021-02-22 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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