Title:
RESIN MATERIAL AND MULTILAYER PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2022/234823
Kind Code:
A1
Abstract:
The present invention provides a resin material which is capable of: (1) decreasing the dielectric loss tangent of a cured product thereof; (2) effectively removing smear by means of a desmear treatment; (3) enhancing the plating peel strength; and (4) making a cured product layer at the edge of a substrate less susceptible to the occurrence of cracks. A resin material according to the present invention contains an epoxy compound, a filler and a curing agent; the filler has an average particle diameter of 2.0 μm or less; and the curing agent contains a first curing agent which has a carbonate structure, while having a functional group that is reactive with an epoxy group.
Inventors:
NISHINAKA KUMIKO (JP)
HAYASHI TATSUSHI (JP)
DEGUCHI HIDENOBU (JP)
OOATARI YUUTA (JP)
HAYASHI TATSUSHI (JP)
DEGUCHI HIDENOBU (JP)
OOATARI YUUTA (JP)
Application Number:
PCT/JP2022/019363
Publication Date:
November 10, 2022
Filing Date:
April 28, 2022
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08G59/40; B32B15/08; C08G59/46; H05K1/03
Domestic Patent References:
| WO2018105282A1 | 2018-06-14 |
Foreign References:
| JP2019089965A | 2019-06-13 | |||
| JPH11503792A | 1999-03-30 |
Attorney, Agent or Firm:
OSAKA FRONT (JP)
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