Title:
RESIN, METHOD FOR PRODUCING RESIN, CURABLE RESIN COMPOSITION, AND CURED OBJECT
Document Type and Number:
WIPO Patent Application WO/2023/021813
Kind Code:
A1
Abstract:
Provided are a novel resin having excellent dielectric characteristics, a method for producing the resin, a curable resin composition, and a cured object. The resin has constituent units given in group (1) (wherein a, b, c, and d independently indicate the molar proportions of the respective constituent units, and a is a number of 1 or larger, b is a number of 0 or larger, c is a number of 1 or larger, and d is a number of 0 or larger).
Inventors:
UOTANI TAKUYA (JP)
AOYAGI NAOTO (JP)
INNAN SUSUMU (JP)
ITOH SYOUICHI (JP)
OGIWARA MASASHI (JP)
OKA HIROAKI (JP)
AOYAGI NAOTO (JP)
INNAN SUSUMU (JP)
ITOH SYOUICHI (JP)
OGIWARA MASASHI (JP)
OKA HIROAKI (JP)
Application Number:
PCT/JP2022/022655
Publication Date:
February 23, 2023
Filing Date:
June 03, 2022
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G14/12; C08F290/14
Domestic Patent References:
| WO2019098338A1 | 2019-05-23 | |||
| WO2003078494A1 | 2003-09-25 | |||
| WO2022034752A1 | 2022-02-17 |
Foreign References:
| JP2020037651A | 2020-03-12 | |||
| JP2019065150A | 2019-04-25 | |||
| JP2002003563A | 2002-01-09 | |||
| JP2020037651A | 2020-03-12 | |||
| JP2015189925A | 2015-11-02 | |||
| JPH01108212A | 1989-04-25 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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