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Title:
RESIN MOLD
Document Type and Number:
WIPO Patent Application WO/2023/157680
Kind Code:
A1
Abstract:
A resin mold (100) according to the present application comprises: a sliding core (3) that is slidably attached to a guide rail (5); and a sensor that detects the force applied to the guide rail (5) during sliding of the sliding core (3).

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Inventors:
HARUI YASUYUKI (JP)
NAKAMURA RYUKI (JP)
Application Number:
PCT/JP2023/003606
Publication Date:
August 24, 2023
Filing Date:
February 03, 2023
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B22D17/22; B22C9/00; B22C9/06; B22D18/02; B22D18/04; B29C33/44; B29C45/44
Domestic Patent References:
WO2016167337A12016-10-20
Foreign References:
JPH09109199A1997-04-28
JP2013154507A2013-08-15
Attorney, Agent or Firm:
PALMO PATENT FIRM, P.C. (JP)
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