Title:
RESIN MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2019/208092
Kind Code:
A1
Abstract:
The present invention includes a resin structure, an intermediate layer that includes an inorganic filler and an organic resin binder and that is provided to the surface of at least part of the resin structure, and a sprayed ceramic film provided on the intermediate layer. The inorganic filler is amorphous in shape, the central particle diameter of the inorganic filler is 20-100 μm (inclusive), the thickness of the intermediate layer is 50-250 μm (inclusive), the central particle diameter a of the inorganic filler and the thickness b of the intermediate layer satisfy the relationship b ≥ 2a, and the amount of the inorganic filler included in the intermediate layer is 40-65% by volume ratio.
Inventors:
KUSUNOKI TOMOKAZU
SAKURAGI KANJI
FUJIMOTO SHINJI
MASUKAWA KOICHI
SAKURAGI KANJI
FUJIMOTO SHINJI
MASUKAWA KOICHI
Application Number:
PCT/JP2019/013709
Publication Date:
October 31, 2019
Filing Date:
March 28, 2019
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
B32B18/00; B32B27/20; C23C4/02; C23C4/11; C23C28/00
Domestic Patent References:
| WO2017179545A1 | 2017-10-19 |
Foreign References:
| JPS6198534A | 1986-05-16 | |||
| JPS6421085A | 1989-01-24 | |||
| JPH0225555A | 1990-01-29 | |||
| JPS60214958A | 1985-10-28 |
Other References:
See also references of EP 3785903A4
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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