Title:
RESIN MOLDED COMPONENT AND HIGH-FREQUENCY MODULE
Document Type and Number:
WIPO Patent Application WO/2024/029279
Kind Code:
A1
Abstract:
Provided is a resin molded component configured for easy lowering of profile. A resin molded component (1) comprises: a resin layer (2); at least one chip-type electronic component (3); a first inorganic thin-film insulating layer (51); and a first thin-film electroconductive layer (52). The resin layer (2) has a first main surface (2a) and a second main surface (2b) that face each other. The at least one chip-type electronic component (3) is provided within the resin layer (2). The first inorganic thin-film insulating layer (51) is provided on the first main surface (2a) of the resin layer (2). The first thin-film conductive layer (52) is provided in the first inorganic thin-film insulating layer (51).
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Inventors:
FURUTANI KOJI
Application Number:
PCT/JP2023/025385
Publication Date:
February 08, 2024
Filing Date:
July 10, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L25/00; H01L23/12; H01L25/04; H01L25/18; H04B1/38
Foreign References:
| JP2017157802A | 2017-09-07 | |||
| JP2020123599A | 2020-08-13 | |||
| JP2016134516A | 2016-07-25 | |||
| JP2010278040A | 2010-12-09 | |||
| JP2021197611A | 2021-12-27 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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