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Title:
RESIN MOLDING APPARATUS AND RESIN MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2012/169599
Kind Code:
A1
Abstract:
This lens molding apparatus (100) is provided with: a molding die (1) having a transfer surface (1a) for transferring a predetermined lens shape to a resin material; a molding die (2) having a transfer surface (2a) for transferring a predetermined lens shape to a resin material; a support device (3) that moves the molding die (1); a heating device (4) that forms a lens by curing the resin material supplied between the transfer surface 1a and the transfer surface 2a; and an ultrasonic transducer (5) that forms a gap between at least part of the transfer surfaces (1a, 2a) and the lens by applying vibrations from a side of the molding dies (1, 2).

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JP4287806Movable mold of molding machine equipped with transfer board
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Inventors:
NAKAHASHI TAKAHIRO
HANATO HIROYUKI
Application Number:
PCT/JP2012/064713
Publication Date:
December 13, 2012
Filing Date:
June 07, 2012
Export Citation:
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Assignee:
SHARP KK (JP)
NAKAHASHI TAKAHIRO
HANATO HIROYUKI
International Classes:
B29C33/44; B29C39/22; B29L11/00
Foreign References:
JPS61283509A1986-12-13
JP2007320037A2007-12-13
JP2007118552A2007-05-17
JPH11207761A1999-08-03
JPH05326597A1993-12-10
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
Patent business corporation Hara [Kenzo] international patent firm (JP)
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