Title:
RESIN MOLDING DEVICE, AND METHOD FOR MANUFACTURING RESIN MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2023/228462
Kind Code:
A1
Abstract:
This resin molding device comprises: a resin feeding mechanism (21) that feeds powder-form resin (R) to a feed receiver (F); a shaping mold that includes an upper mold and a lower mold opposing the upper mold, the powder-form resin (R) being disposed between the upper and lower molds; and a mold clamping mechanism that clamps the shaping mold for compression molding. The resin feeding mechanism (21) includes: a rotary body (230) that is shaped as a circular column having a plurality of recesses (232a) in the outer peripheral surface (231) thereof, and that rotates about an axial center (X); a resin feeding unit (220) in which powder-form resin (R) is collected and an opening (223) is formed through which the powder-form resin (R) free-falls and is fed to the rotary body (230); and a paddle member (224) disposed such that one end thereof contacts the outer peripheral surface (231) of the rotary body.
Inventors:
SUNADA MAMORU (JP)
HAYASHI KOSUKE (JP)
ONISHI YOHEI (JP)
MORITA KEN (JP)
HAYASHI KOSUKE (JP)
ONISHI YOHEI (JP)
MORITA KEN (JP)
Application Number:
PCT/JP2023/000364
Publication Date:
November 30, 2023
Filing Date:
January 11, 2023
Export Citation:
Assignee:
TOWA CORP (JP)
International Classes:
B29C43/34; B29C31/04; B29C43/18
Foreign References:
| JP2017193095A | 2017-10-26 | |||
| JP2007044587A | 2007-02-22 |
Attorney, Agent or Firm:
R&C IP LAW FIRM (JP)
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