RESIN MOLDING DEVICE AND RESIN MOLDING METHOD

WIPO Patent Application WO/2014/192456

A1

The present invention addresses the problem of providing technology that is capable of improving the quality of moldings. As a solution, the lower mold (32) is provided with: a lower mold cavity piece (34) for configuring the bottom of a cavity (33); lower mold clampers (35) for configuring the sides of the cavity (33); a film loader (57) capable of holding and conveying a film (F) on which a resin (R) has been loaded; and a suction section (67) for picking up the film (F), which is disposed so as to cover the edges of the lower mold cavity piece (34) and the edges of the lower mold clampers (35). The lower mold cavity piece (34) moves relative to the lower mold clampers (35). The film loader (57) disposes the film (F) on the lower mold (32), in which the edges of the lower mold cavity piece (34) are held level with the edges of the lower mold clampers (35), so that the resin (R) is positioned above the lower mold cavity piece (34). The suction section (67) picks up and holds the film (F) so as to conform to the inner surface of the cavity (33) and supplies the resin (R) to the cavity (33).

FUJISAWA MASAHIKO (JP)
NAKAZAWA HIDEAKI (JP)
MURAMATSU YOSHIKAZU (JP)

PCT/JP2014/061014

December 04, 2014

April 18, 2014

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APIC YAMADA CORP (JP)

B29C43/36; B29C43/32; H01L21/56

JP2008254266A	2008-10-23
JP2005186439A	2005-07-14
JP2006027098A	2006-02-02
JP2010214595A	2010-09-30
JP2008132719A	2008-06-12

WATANUKI PATENT SERVICE BUREAU (JP)
A patent business corporation Watanuki international patent and a trademark office (JP)

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