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Title:
RESIN MULTILAYER SUBSTRATE AND METHOD FOR PRODUCING RESIN MULTILAYER SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2020/121801
Kind Code:
A1
Abstract:
This resin multilayer substrate (101) is provided with: a resin substrate (10) formed by layering a plurality of resin layers; functional conductive patterns (31, 32, 33) formed on at least one of the plurality of resin layers; and first dummy conductors (D111, D112, D113, D114, D121, D122, D123, D124, D131, D132, D133, D134) each formed on the plurality of resin layers including the resin layer or layers on which the functional conductor patterns (31, 32, 33) are formed. The first dummy conductors do not conduct electricity to the functional conductor patterns (31, 32, 33). The plurality of first dummy conductors are arranged so as to surround the functional conductor patterns (31, 32, 33) in an intermittent manner when viewed from the layering direction. In addition, first dummy conductors adjacent to each other in the layering direction are arranged so as not to overlap with each other when viewed from the layering direction.

Inventors:
TAGO SHIGERU (JP)
KAMITSUBO YUSUKE (JP)
TANAKA CHIE (JP)
SATO TAKAKO (JP)
MAEGAWA HIROKI (JP)
Application Number:
PCT/JP2019/046100
Publication Date:
June 18, 2020
Filing Date:
November 26, 2019
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01F17/00; H05K1/16; H05K3/46
Domestic Patent References:
WO2017159437A12017-09-21
WO2006011291A12006-02-02
WO2015079773A12015-06-04
Foreign References:
JP2013232462A2013-11-14
JP2007273577A2007-10-18
JP2004140587A2004-05-13
JPH09289128A1997-11-04
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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