Title:
RESIN PASTE COMPOSITION, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/044631
Kind Code:
A1
Abstract:
A resin paste composition according to the present invention includes: silver-coated particles having non-conductive particles and silver that coats said non-conductive particles; and silver particles. A semiconductor device according to the present invention comprises: a support member; and a semiconductor element, wherein the support member and the semiconductor element are bonded by a cured product of this resin paste composition.
Inventors:
KAMONO MEGUMI (JP)
ISHII MANABU (JP)
FUJITA MASARU (JP)
KOBAYASHI KEIKO (JP)
WARASHINA MIREI (JP)
ISHII MANABU (JP)
FUJITA MASARU (JP)
KOBAYASHI KEIKO (JP)
WARASHINA MIREI (JP)
Application Number:
PCT/JP2019/035264
Publication Date:
March 11, 2021
Filing Date:
September 06, 2019
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
H01B1/22; C09J9/02; C09J11/04; C09J201/00; H01L21/52
Domestic Patent References:
| WO2015033834A1 | 2015-03-12 |
Foreign References:
| JPH09296158A | 1997-11-18 | |||
| JP2016130354A | 2016-07-21 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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