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Title:
RESIN POWDER FOR THREE-DIMENSIONAL MOLDING, THREE-DIMENSIONAL MOLDED ARTICLE, AND METHOD FOR PRODUCING THREE-DIMENSIONAL MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2020/213586
Kind Code:
A1
Abstract:
This resin powder for three-dimensional molding contains ethylene-propylene copolymer particles, wherein the volume average particle size of the ethylene-propylene copolymer particles is 5-200 μm, the ethylene content molar ratio (ethylene/(ethylene+propylene)) in the ethylene-propylene copolymer particles is 0.001-0.04, and the melt flow rate (MRF) is 3-40 g/10 min at 230°C.

Inventors:
SHIRAISHI MASAHARU (JP)
GOTO KENJI (JP)
HAGIWARA MASASHI (JP)
KIMURA YUSEI (JP)
Application Number:
PCT/JP2020/016368
Publication Date:
October 22, 2020
Filing Date:
April 14, 2020
Export Citation:
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Assignee:
KONICA MINOLTA INC (JP)
ASPECT INC (JP)
International Classes:
B33Y10/00; B29C64/153; B33Y70/00; B33Y80/00
Domestic Patent References:
WO2018041839A12018-03-08
WO2004016662A12004-02-26
Foreign References:
JP2019001154A2019-01-10
JPS642810B21989-01-18
JPS5763310A1982-04-16
JPH05170843A1993-07-09
JP2001354714A2001-12-25
EP0585869A11994-03-09
EP0585869A11994-03-09
JPH0312428A1991-01-21
Other References:
See also references of EP 3957481A4
Attorney, Agent or Firm:
KOYO INTERNATIONAL PATENT FIRM (JP)
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