RESIN-SEALED VEHICLE-MOUNTED CONTROL DEVICE - HITACHI AUTOMOTIVE SYSTEMS LTD

Title:

RESIN-SEALED VEHICLE-MOUNTED CONTROL DEVICE

Document Type and Number:

WIPO Patent Application WO/2017/150053

Kind Code:

A1

Abstract:

The purpose of the present invention is to provide an ECU structure which allows for the filling of a resin without warping an electronic substrate. A resin-sealed vehicle-mounted control device comprises a circuit substrate, a base member which houses the circuit substrate, and a resin filled between the circuit substrate and the base member, wherein the base member includes a base portion to which the circuit substrate is fixed, and a side wall opposing a lateral-face side of the circuit substrate, wherein the resin is provided at least between the circuit substrate and the base portion, and the side wall has an opening somewhere closer to the base portion side than a position opposing the lateral-face side of the electronic substrate.

Inventors:

ITO MAKI (JP)
ISHII TOSHIAKI (JP)
KAWAI YOSHIO (JP)
TSUYUNO NOBUTAKE (JP)
KANEKO YUJIRO (JP)
FUKUZAWA TAKAYUKI (JP)
ASANO MASAHIKO (JP)

Application Number:

PCT/JP2017/003512

Publication Date:

September 08, 2017

Filing Date:

February 01, 2017

Export Citation:

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Assignee:

HITACHI AUTOMOTIVE SYSTEMS LTD (JP)

International Classes:

H05K3/28; H01L21/56; H01L25/07; H01L25/18; H05K5/00

Foreign References:

JP2014015080A	2014-01-30
JP2010199152A	2010-09-09
JP2010056355A	2010-03-11
JP2014203871A	2014-10-27