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Patent Searching and Data


Title:
RESIN SEALING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/097714
Kind Code:
A1
Abstract:
This resin sealing apparatus (1) for resin sealing molding a plurality of articles to be molded is provided with a transfer mechanism unit (17) and a processing unit (42). The transfer mechanism unit (17) transfers a plurality of plungers by the intermediary of springs that are different from each other, said plungers respectively facing resin members that are supplied into corresponding pots among a plurality of pots that are connected to cavities that are different from each other via resin flow channels that are different from each other. The processing unit (42) determines the loads to be applied to the plurality of plungers by the transfer mechanism unit (17) on the basis of the kinds of the plurality of articles to be molded, said articles being respectively arranged in corresponding cavities among the plurality of cavities, so that the loads to be applied to the resin members by the plurality of plungers are within predetermined ranges.

Inventors:
NAKAHARA NORIMASA (JP)
NISHIMURA TOSHIHIDE (JP)
Application Number:
PCT/JP2021/040754
Publication Date:
May 12, 2022
Filing Date:
November 05, 2021
Export Citation:
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Assignee:
I PEX INC (JP)
International Classes:
B29C45/02; B29C45/26; B29C45/76; H01L21/56
Foreign References:
JPH06238701A1994-08-30
JPH11300783A1999-11-02
JPH11126786A1999-05-11
JP2010228157A2010-10-14
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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