Title:
RESIN-SEALING DEVICE AND RESIN-SEALING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/087894
Kind Code:
A1
Abstract:
The purpose of the present invention is to resin-seal a workpiece while the workpiece is being adhesively held securely in a high-vacuum state of not more than about 100 Pa. A resin-sealing device is provided with: a first molding mold including a holding surface for a workpiece on which a semiconductor element is mounted; a second molding mold including a cavity into which uncured resin is supplied, the cavity facing a mounting surface of the workpiece, being held on the holding surface of the first molding mold, on which the semiconductor element is mounted; a openable and closable depressurization chamber formed between the first molding mold and the second molding mold; a drive unit which causes one or both of the first molding mold and the second molding mold to move relatively closer to one another in the opposing direction of the first molding mold and the second molding mold so as to form the depressurization chamber; a pressure adjustment unit which performs an internal pressure adjustment from atmospheric atmosphere to a depressurized atmosphere having a predetermined vacuum degree by evacuating or supplying air into the depressurization chamber and an external space; and a control unit which controls the operation of the drive unit and the pressure adjustment unit. The holding surface of the first molding mold includes an adhesive portion which is in detachable contact with a non-mounting surface on the opposite side from the workpiece mounting surface. The control unit implements a control such that, in a state in which the depressurization chamber has been evacuated to a high vacuum of about 100 Pa or less by the pressure adjustment unit, the workpiece mounting surface is dipped in the uncured resin in the cavity by the drive unit.
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| JPS62266854 | MANUFACTURE OF RESIN SEALED TYPE LEADLESS DIODE |
| JPH05285976 | MOLDING DEVICE |
| JPS6374608 | METHOD FOR MOLDING COMPONENT EQUIPPED WITH LEAD |
Inventors:
OHTANI YOSHIKAZU (JP)
MORI HIROHARU (JP)
TAKAHASHI HIROSHI (JP)
MORI HIROHARU (JP)
TAKAHASHI HIROSHI (JP)
Application Number:
PCT/JP2016/083590
Publication Date:
May 17, 2018
Filing Date:
November 11, 2016
Export Citation:
Assignee:
SHIN ETSU ENG CO LTD (JP)
International Classes:
H01L21/56; B29C33/18
Foreign References:
| JP2005064456A | 2005-03-10 | |||
| JP2014075443A | 2014-04-24 | |||
| JP2013012573A | 2013-01-17 | |||
| JP2014019086A | 2014-02-03 |
Other References:
See also references of EP 3540765A4
Attorney, Agent or Firm:
EICHI PATENT & TRADEMARK CORP. (JP)
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