Title:
RESIN SEALING DEVICE AND RESIN SEALING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/047916
Kind Code:
A1
Abstract:
Provided are a resin sealing device and method with which it is possible to remove a gate part with high precision and to miniaturize and increase the mounting density of molded articles. This resin sealing method comprises: a resin sealing step for inputting a tablet-like resin (R) into a pot (240), and pressing with a plunger (242) to pump the resin into a cavity (208) through a runner (247) from a cull (246), so as to seal a workpiece (W) with the resin (R); and a degating step for extracting, from a sealing mold (202), a molded article (Wp) which has been subjected to the resin sealing step, and removing unnecessary resin portions from the molded article (Wp), wherein, in the degating step, a runner breaking step is carried out for removing a cull portion (Rc) and a runner portion (Rr), which are unnecessary resin portions formed at the positions of the cull (246) and the runner (247), and thereafter a gate cutting step is carried out for removing a gate portion (Rg), which is an unnecessary resin portion formed at the position of a gate (248) between the runner (247) and the cavity (208).
Inventors:
KANAI MASAYA (JP)
TERASAWA HIROKO (JP)
KANAI EIJI (JP)
TERASAWA HIROKO (JP)
KANAI EIJI (JP)
Application Number:
PCT/JP2023/009395
Publication Date:
March 07, 2024
Filing Date:
March 10, 2023
Export Citation:
Assignee:
APIC YAMADA CORP (JP)
International Classes:
H01L21/56; B29C45/14; B29C45/17; B29C45/26
Foreign References:
| JP7121835B1 | 2022-08-18 | |||
| JP2000306934A | 2000-11-02 | |||
| JP2021034479A | 2021-03-01 | |||
| JP2007129113A | 2007-05-24 | |||
| JP2000003921A | 2000-01-07 | |||
| JPS63184344A | 1988-07-29 | |||
| JP2012043839A | 2012-03-01 |
Attorney, Agent or Firm:
WATANUKI PATENT SERVICE BUREAU (JP)
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