RESIN SHEET, LAMINATE, AND SEMICONDUCTOR DEVICE

Title:

RESIN SHEET, LAMINATE, AND SEMICONDUCTOR DEVICE

Document Type and Number:

WIPO Patent Application WO/2022/255450

Kind Code:

A1

Abstract:

This resin sheet contains a binder resin and boron nitride particles, wherein the boron nitride particle content is 30-80 vol%, the porosity in the cross-section of the resin sheet is 0.01-2.0%, and the melt viscosity ratio {[maximum melt viscosity (Pa・s) from 40 °C to 195 °C]/[average melt viscosity (Pa・s) from 40 °C to 100 °C]} is at least 2 in a melt viscosity measurement measured from 40 °C to 195 °C at a temperature rise rate of 8 °C/minute.　The present invention can provide a resin sheet having excellent insulation properties and thermal conductivity and excellent adhesiveness to a metal plate.

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Inventors:

MIZUNO SHOHEI (JP)
KOUMA AKI (JP)
OOWASHI KEIGO (JP)
KANESHIMA YUKI (JP)

Application Number:

PCT/JP2022/022489

Publication Date:

December 08, 2022

Filing Date:

June 02, 2022

Export Citation:

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Assignee:

SEKISUI CHEMICAL CO LTD (JP)

International Classes:

H05K1/03; B32B15/08; B32B27/18; H01L23/12; H01L23/36; H01L23/373

Foreign References:

JP2019150997A	2019-09-12
JP2013082873A	2013-05-09
JP2013227451A	2013-11-07
JP2013254880A	2013-12-19
JP2020102556A	2020-07-02

Attorney, Agent or Firm:

TAGUCHI, Masahiro et al. (JP)

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