Title:
RESIN SHEET
Document Type and Number:
WIPO Patent Application WO/2022/196696
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a resin sheet in which unevenness after lamination can be suppressed and warping after curing can be suppressed. The present invention provides a resin sheet which comprises a supporting body and a resin composition layer that is provided on the supporting body, wherein: the resin composition layer contains (A) an epoxy resin, (B) an organic solvent, (C) an inorganic filler and (D) a stress relaxation material; and the content of an aromatic solvent having a boiling point of less than 120°C in the component (B) is 0% to 9% by mass if the total amount of the component (B) is taken as 100% by mass.
Inventors:
IKEHIRA SHU (JP)
Application Number:
PCT/JP2022/011679
Publication Date:
September 22, 2022
Filing Date:
March 15, 2022
Export Citation:
Assignee:
AJINOMOTO KK (JP)
International Classes:
B32B27/38; B32B15/08; C08G59/42; C08K3/013; C08L63/00; H05K1/03; H05K3/46
Foreign References:
| JP2020037652A | 2020-03-12 | |||
| JP2011144361A | 2011-07-28 | |||
| JP2020083966A | 2020-06-04 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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