Title:
RESIN SUBSTRATE LAMINATE AND MANUFACTURING METHOD FOR ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/059319
Kind Code:
A1
Abstract:
Provided are: a resin substrate laminate which enables a resin substrate to be easily released from a release layer through a brief light irradiation process using a low-energy laser beam; and a manufacturing method for an electronic device using said resin substrate laminate. This resin substrate laminate is characterized by being provided with: a release-layer-equipped support substrate 4 which has a support substrate 1 and a release layer 2 laminated on top of the support substrate 1; and a resin substrate 3 which is releasably laminated on a surface, of the release layer 2, that is opposite to the surface on which the support substrate 1 is laminated, wherein the surface of the release layer 2 has a composition of SixCyOz (where 0.05≤x≤0.49, 0.15≤y≤0.73, 0.22≤z≤0.36, and x+y+z=1 are satisfied).
More Like This:
Inventors:
SUGAWARA HIROYUKI (JP)
Application Number:
PCT/JP2018/034926
Publication Date:
March 28, 2019
Filing Date:
September 20, 2018
Export Citation:
Assignee:
GEOMATEC CO LTD (JP)
International Classes:
H01L21/02; B32B9/00; B32B27/00; H01L21/203
Foreign References:
| JP2015093405A | 2015-05-18 | |||
| JP2017050322A | 2017-03-09 | |||
| JP2004171001A | 2004-06-17 | |||
| JP2008177182A | 2008-07-31 |
Attorney, Agent or Firm:
AKIYAMA, Atsushi et al. (JP)
Download PDF: