Title:
RESIN SUBSTRATE, AND METHOD FOR MANUFACTURING RESIN SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2020/026959
Kind Code:
A1
Abstract:
A resin substrate (101) is provided with: a resin base material (10) having a first main surface (VS1); and electrode pads (P1, P2), circuit conductive patterns (31, 32), a resist film (21) and a coverlay film (1) which are formed on the first main surface (VS1). The resist film (21) has, formed on the outer periphery thereof, multiple protruding parts (PR1, PR2) each having a tip and a tapered shape. A part of each of the circuit conductive patterns (31, 32) is covered with the resist film (21), and the coverlay film (1) covers a part of the resist film (21) including the protruding parts (PR1, PR2) and exposed parts (ECP1, ECP2) of the circuit conductive patterns. The protruding parts (PR1, PR2) are arranged at positions that interpose the exposed parts (ECP1, ECP2) of the circuit conductive patterns (31, 32) therebetween.
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Inventors:
ARAKI SHINICHI (JP)
KOMAKI KUNIHIRO (JP)
KOMAKI KUNIHIRO (JP)
Application Number:
PCT/JP2019/029328
Publication Date:
February 06, 2020
Filing Date:
July 26, 2019
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/28; H05K3/34
Domestic Patent References:
| WO2018037871A1 | 2018-03-01 | |||
| WO2013069763A1 | 2013-05-16 |
Foreign References:
| JP2005175185A | 2005-06-30 | |||
| JPH0425269U | 1992-02-28 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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