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Patent Searching and Data


Title:
RESIN SURFACE HYDROPHILIZATION METHOD, PLASMA TREATMENT DEVICE, LAMINATE BODY AND LAMINATE BODY PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2021/029333
Kind Code:
A1
Abstract:
A laminate body is provided in which a resin substrate and a metal vapor deposition film are strongly adhered. This laminate body production method involves a desorption step (S10), an introduction step (S20), a vapor deposition step (S30) and a coating step (S40). In the desorption step (S10), a hydrophobic surface of resin is irradiated with plasma, and at least some of the atoms constituting the resin are desorbed from the surface. In the introduction step (S20), the surface of the resin which has been subjected to the desorption step (S10) is irradiated with hydroxyl radicals, introducing hydroxyl groups into the resin surface. In the vapor deposition step (S30), a metal film is vapor-deposited on the resin surface which has been subjected to the introduction step (S20). In the coating step (S40), the surface of the metal film is coated with a metal layer configured from the same metal as the metal constituting the metal film.

Inventors:
HASHIGUCHI HARUO (JP)
KUBO HIROYOSHI (JP)
Application Number:
PCT/JP2020/030261
Publication Date:
February 18, 2021
Filing Date:
August 06, 2020
Export Citation:
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Assignee:
KOMIYAMA ELECTRON CORP (JP)
International Classes:
C08J7/00
Foreign References:
JP2000080184A2000-03-21
JP2003201571A2003-07-18
JP2003008179A2003-01-10
JP2008308616A2008-12-25
JP2001513832A2001-09-04
JP2008084820A2008-04-10
JP2015124343A2015-07-06
Attorney, Agent or Firm:
SANO, Hiroshi et al. (JP)
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