RESIN TRANSFER MOLDING METHOD AND RESIN TRANSFER MOLDING DEVICE

Title:

RESIN TRANSFER MOLDING METHOD AND RESIN TRANSFER MOLDING DEVICE

Document Type and Number:

WIPO Patent Application WO/2012/157327

Kind Code:

A1

Abstract:

The purpose of the present invention is to provide a method for molding a molded article in which the surface and interior are free of voids, porosity, and resin shrinkage while sheet thickness accuracy is maintained even with a thick-sheet member having a thickness of 10 mm or more. A resin transfer molding method comprising: a first heating step for impregnating, with a thermoplastic resin, a reinforcing fiber substrate disposed within a molding die constituted of two or more separate die members, and thereafter heating any of the die members constituting the molding die to form a temperature gradient having a temperature difference of a predetermined value or greater from one side of the reinforcing fiber substrate to the other side; and a second heating step for heating another die member that is different from the die member heated in the first heating step.

Inventors:

AKIYAMA HIROMICHI (JP)
KANEMASU MASAYUKI (JP)

Application Number:

PCT/JP2012/056696

Publication Date:

November 22, 2012

Filing Date:

March 15, 2012

Export Citation:

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Assignee:

MITSUBISHI HEAVY IND LTD (JP)
AKIYAMA HIROMICHI (JP)
KANEMASU MASAYUKI (JP)

International Classes:

B29C39/38; B29C39/10; B29C70/06; B29K101/10; B29K105/08

Foreign References:

JP2005246902A	2005-09-15
JPH04144723A	1992-05-19
JP2003025346A	2003-01-29
JP3421101B2	2003-06-30

Other References: