Title:
RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, COMPOUND, AND POLYMER COMPOUND
Document Type and Number:
WIPO Patent Application WO/2024/053718
Kind Code:
A1
Abstract:
The present invention employs a resist composition that contains a resin component having a constituent unit represented by general formula (a0-1). In formula (a0-1), R01 is a divalent linking group or a single bond. R02 is an acid-dissociable group. Y00 is a divalent linking group or single bond. R00 is an aromatic hydrocarbon group that may have a substituent. Y01 is a single bond or a divalent linking group that contains an oxygen atom. V01 is a single bond, an alkylene group, or a fluorinated alkylene group. R03 is a hydrogen atom, a fluorine atom, or a fluorinated alkyl group. Mm+ is an m-valent onium cation. m is an integer of 1 or more. The resist composition has high sensitivity at the time of formation of a resist pattern, and has good lithographic characteristics.
Inventors:
KATO HIROKI (JP)
Application Number:
PCT/JP2023/032751
Publication Date:
March 14, 2024
Filing Date:
September 07, 2023
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
G03F7/039; C07C309/12; C07C381/12; C08F20/10; G03F7/004; G03F7/20
Foreign References:
| JP2012224586A | 2012-11-15 | |||
| JP2014058511A | 2014-04-03 | |||
| JP2013067777A | 2013-04-18 | |||
| JP2022032972A | 2022-02-25 | |||
| JP2018115157A | 2018-07-26 | |||
| JP2014153440A | 2014-08-25 | |||
| JP2014152122A | 2014-08-25 |
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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