Title:
RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, COMPOUND, AND ACID DIFFUSION CONTROL AGENT
Document Type and Number:
WIPO Patent Application WO/2024/071125
Kind Code:
A1
Abstract:
A resist composition comprises: a resin component (A1), the solubility of which in a developer solution is changed by the action of acid; and a compound (D0) represented by general formula (d0). In the formula: Ar is an aromatic ring; Xd is an iodine atom, fluorine atom, bromine atom, or a fluorinated alkyl group; Rd is a substituent; nd is an integer equal to or greater than 1, valence permitting; md is an integer equal to or greater than 0, valence permitting; Ld is a single bond or a divalent linking group; and m is an integer equal to or greater than 1 and Mm+ is an m-valent cation.
Inventors:
FUJII TATSUYA (JP)
NGUYEN KHANHTIN (JP)
NGUYEN KHANHTIN (JP)
Application Number:
PCT/JP2023/034959
Publication Date:
April 04, 2024
Filing Date:
September 26, 2023
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
G03F7/004; C07C59/21; C07C381/12; G03F7/039
Domestic Patent References:
| WO2014188762A1 | 2014-11-27 |
Foreign References:
| CN112062695A | 2020-12-11 | |||
| JP2023046908A | 2023-04-05 |
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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