Title:
RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, COMPOUND, ACID GENERATING AGENT, ACID DIFFUSION CONTROL AGENT, AND HIGH MOLECULAR WEIGHT COMPOUND
Document Type and Number:
WIPO Patent Application WO/2023/027118
Kind Code:
A1
Abstract:
This resist composition generates an acid when being exposed to light and changes the solubility with respect to a developer through the action of the acid. The resist composition contains a compound including a cation (C0) represented by general formula (c0). X01 represents an electron-withdrawing group, X02 represents an electron-withdrawing group different from X01, and R01 represents an electron donating group. R02 and R03 each independently represent a substituent group nx1 and nx2 each independently represent an integer of 1-4, n1 represents an integer of 0-3, and nx1+nx2+n1≤5 is satisfied. n2 and n3 each independently represent an integer of 0-4.
Inventors:
ARAI MASATOSHI (JP)
TODOROKI SEIJI (JP)
TODOROKI SEIJI (JP)
Application Number:
PCT/JP2022/031908
Publication Date:
March 02, 2023
Filing Date:
August 24, 2022
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
G03F7/004; C07D317/70; C07D319/08; C07D333/76; C08F20/38; G03F7/039
Domestic Patent References:
| WO2021095356A1 | 2021-05-20 |
Foreign References:
| JP2021038203A | 2021-03-11 | |||
| JP2012136511A | 2012-07-19 | |||
| JP2021151989A | 2021-09-30 | |||
| JP2021151990A | 2021-09-30 |
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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