Title:
RESIST COMPOSITION AND RESIST PATTERN FORMATION METHOD
Document Type and Number:
WIPO Patent Application WO/2023/112893
Kind Code:
A1
Abstract:
The resist composition comprises: a resin component (A1) that exhibits a change in solubility in a developing solution due to the action of an acid; a photodegradable base (D0); and a fluorine additive component (F). The fluorine additive component (F) comprises a polymer compound that contains a constituent unit (f01) given by formula (f01-1) and a constituent unit (f02) given by formula (f02-1). R is a hydrogen atom and so forth. Vf01 is an alkylene group or a halogenated alkylene group. Yf01 is -CO-O- or -O-CO-. Rf01 is a fluorine atom-containing organic group. Vf02 is a divalent hydrocarbon group. Rf02 is an acid-cleavable group given by formula (f02-r1-1). Rf021, Rf022, Rf023, Rf024, and Rf025 are a hydrocarbon group. Yf02 is a quaternary carbon atom.
Inventors:
ADEGAWA MINORU (JP)
NAKAMURA TSUYOSHI (JP)
TAKAKI DAICHI (JP)
TSUJI HIROMITSU (JP)
NAKAMURA KUMI (JP)
NAKAMURA TSUYOSHI (JP)
TAKAKI DAICHI (JP)
TSUJI HIROMITSU (JP)
NAKAMURA KUMI (JP)
Application Number:
PCT/JP2022/045673
Publication Date:
June 22, 2023
Filing Date:
December 12, 2022
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
C08F220/28; G03F7/004; G03F7/039; G03F7/20
Foreign References:
| JP2016126309A | 2016-07-11 | |||
| JP2013057836A | 2013-03-28 |
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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