Title:
RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, COMPOUND, AND ACID DIFFUSION CONTROL AGENT
Document Type and Number:
WIPO Patent Application WO/2024/101044
Kind Code:
A1
Abstract:
Provided are a resist composition in which the temporal stability during storage is increased and a decrease in fine resolution after storage is reduced, a resist pattern formation method using said resist composition, and a compound useful as an acid diffusion control agent to be used for the resist composition. The present invention uses a resist composition containing: a base material component (A) in which the solubility with respect to a developer changes by the action of an acid; and a compound (D0) represented by general formula (d0). In formula (d0), R1 represents a saturated hydrocarbon group and I represents an iodine atom. R2 represents a substituent group. Yd0 represents a divalent linkage group or a single bond. j represents an integer of 0-3. k represents an integer of 1-4. At least one of Rb11, Rb12, Rb13, and Rb14 represents a fluorine atom or a fluorinated alkyl group. Rb2 and Rb3 each represent a hydrocarbon group or are bound to each other to form a ring together with a sulfur atom.
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Inventors:
KATO HIROKI (JP)
MATSUSHITA TETSUYA (JP)
MATSUSHITA TETSUYA (JP)
Application Number:
PCT/JP2023/036248
Publication Date:
May 16, 2024
Filing Date:
October 04, 2023
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
G03F7/004; C07C65/21; C07C381/12; C07D333/76; G03F7/039
Domestic Patent References:
| WO2021039331A1 | 2021-03-04 | |||
| WO2023048168A1 | 2023-03-30 |
Foreign References:
| JP2023074458A | 2023-05-29 |
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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