Title:
RESIST COMPOSITION, RESIST PATTERN FORMING METHOD, COMPOUND, AND ACID GENERATOR
Document Type and Number:
WIPO Patent Application WO/2023/176546
Kind Code:
A1
Abstract:
The present invention provides a resist composition which contains a base material component (A) and a compound (B0) that is represented by general formula (b0). In the formula, Rpg represents an acid-decomposable group; Rl0 represents an optionally substituted cyclic organic group; L02 represents a divalent linking group; L01 represents a divalent linking group or a single bond; Rm1 represents a substituent other than an iodine atom; Vb0 represents a single bond or the like; R0 represents a hydrogen atom or the like; nb1 represents an integer of 1 to 4, nb2 represents an integer of 1 to 4, and nb3 represents an integer of 0 to 3; Mm+ represents an organic cation having a valency of m; and m represents an integer of 1 or more.
Inventors:
NGUYEN KHANHTIN (JP)
Application Number:
PCT/JP2023/008296
Publication Date:
September 21, 2023
Filing Date:
March 06, 2023
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
G03F7/004; C07C309/12; C07C381/12; C09K3/00; G03F7/039; G03F7/20
Domestic Patent References:
| WO2021241246A1 | 2021-12-02 |
Foreign References:
| JP2020181064A | 2020-11-05 | |||
| JP2018159744A | 2018-10-11 | |||
| JP2018025789A | 2018-02-15 |
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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