Title:
RESIST COMPOSITION, RESIST PATTERN FORMING METHOD AND COMPOUND
Document Type and Number:
WIPO Patent Application WO/2023/199907
Kind Code:
A1
Abstract:
The present invention employs a resist composition which generates an acid upon exposure to light and changes the solubility with respect to a developer solution by the action of the acid, and which contains a compound that is represented by general formula (d0). In general formula (d0), RAr represents an aromatic hydrocarbon group; t represents an integer of 1 or more; each of R01 and R02 represents a chain hydrocarbon group, and R03 represents a chain hydrocarbon group or a hydrogen atom; or alternatively, two or more moieties among the R01, R02 and R03 moieties combine with each other to form a ring structure; m represents an integer of 1 or more; and Mm+ represents an organic cation having a valence of m. This resist composition is capable of enhancing both the roughness characteristics and the effect of suppressing the occurrence of a defect.
Inventors:
TAKAKI DAICHI (JP)
NAKAMURA TSUYOSHI (JP)
NAGAMINE TAKASHI (JP)
NAKAMURA TSUYOSHI (JP)
NAGAMINE TAKASHI (JP)
Application Number:
PCT/JP2023/014666
Publication Date:
October 19, 2023
Filing Date:
April 11, 2023
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
G03F7/004; C07C65/05; C07C65/105; C07C65/17; C07C381/12; G03F7/039
Domestic Patent References:
| WO2023032794A1 | 2023-03-09 | |||
| WO2022244682A1 | 2022-11-24 |
Foreign References:
| JP2011090147A | 2011-05-06 | |||
| JP2018172525A | 2018-11-08 | |||
| US20200353087A1 | 2020-11-12 | |||
| JP2006306933A | 2006-11-09 | |||
| JP2004532141A | 2004-10-21 | |||
| JP2020203984A | 2020-12-24 | |||
| JPH11125907A | 1999-05-11 |
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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