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Title:
RESIST COMPOSITION FOR PATTERN PRINTING USE, AND METHOD FOR MANUFACTURING CIRCUIT PATTERN USING SAME
Document Type and Number:
WIPO Patent Application WO/2019/244651
Kind Code:
A1
Abstract:
A resist composition for pattern printing use, comprising: a resin (A) which is composed of a combination of at least two amino-group-containing resins each containing an amino group and having different amine values from each other and which has an overall amine value of 1.5 to 10.0; a compound (B) which can generate an amine by the action of water and/or light; a thickening agent (C) component; and a diluent (D) component. The resist composition has high resistance to an alkaline etching solution, can be removed easily with an aqueous acidic solution, and can form a protective pattern by printing.

Inventors:
TAMAI HITOSHI (JP)
TAKAHASHI YUJI (JP)
OKAMOTO SHIMPEI (JP)
NAKANO KUNIHIRO (JP)
Application Number:
PCT/JP2019/022491
Publication Date:
December 26, 2019
Filing Date:
June 06, 2019
Export Citation:
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Assignee:
KANEKA CORP (JP)
International Classes:
H05K3/06; H01B13/00; H01L21/312; H01L31/0224; H01L31/0445
Domestic Patent References:
WO2009099065A12009-08-13
Foreign References:
JPH1064333A1998-03-06
JP2001133982A2001-05-18
JPH07261385A1995-10-13
JPH02224295A1990-09-06
JPH0651516A1994-02-25
JP3711198B22005-10-26
JPH07242737A1995-09-19
Other References:
See also references of EP 3806593A4
Attorney, Agent or Firm:
NIIYAMA Yuichi et al. (JP)
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