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Patent Searching and Data


Title:
RESIST COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2020/137309
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a resist composition which exhibits high heat resistance and can be used in types of lithography that use electron beams and extreme ultraviolet radiation. Specifically, the present invention uses a resist composition that contains a metal salt of a novolac type phenolic resin (C), which is obtained using (A) an aromatic compound represented by formula (1) and (B) an aliphatic aldehyde as essential reaction raw materials. (In formula (1), R1 and R2 each independently denote a hydrogen atom, an aliphatic hydrocarbon group having 1-9 carbon atoms, an alkoxy group, an aryl group, an aralkyl group or a halogen atom. m and n each independently denote an integer between 0 and 4. In cases where a plurality of R1 groups are present, the plurality of R1 groups may be the same as, or different from, each other. In cases where a plurality of R2 groups are present, the plurality of R2 groups may be the same as, or different from, each other. R3 denotes a hydrogen atom, an aliphatic hydrocarbon group having 1-9 carbon atoms, or a structural moiety having one or more substituent groups selected from among alkoxy groups, halogen groups and hydroxyl groups on a hydrocarbon group.)

Inventors:
IMADA TOMOYUKI (JP)
NAGATA HIROHITO (JP)
Application Number:
PCT/JP2019/046091
Publication Date:
July 02, 2020
Filing Date:
November 26, 2019
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08G8/18; C08G8/20; G03F7/023; G03F7/20
Domestic Patent References:
WO2010073583A12010-07-01
WO2016056355A12016-04-14
Foreign References:
JP2016004209A2016-01-12
JP2017037326A2017-02-16
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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