Title:
RESIST PROCESSING APPARATUS, RESIST APPLYING/DEVELOPING APPARATUS AND RESIST PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2010/004827
Kind Code:
A1
Abstract:
Provided is a resist processing apparatus which processes a resist film formed on a substrate. The resist processing apparatus is provided with: a processing container which can maintain inside thereof in a vacuum state; a placing table, which is arranged inside the processing container and permits the substrate having the resist film formed thereon to be placed on the placing table; a gas supply section which jets a mixed gas, which contains chemically inert first gas and second gas, at a predetermined flow quantity toward the placing table; and an air releasing section which can release air from the processing container to a vacuum degree where the mixed gas jetted at the predetermined flow quantity from the gas supply section can be a molecular beam in the processing container.
Inventors:
KOBAYASHI SHINJI (JP)
Application Number:
PCT/JP2009/060633
Publication Date:
January 14, 2010
Filing Date:
June 10, 2009
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
KOBAYASHI SHINJI (JP)
KOBAYASHI SHINJI (JP)
International Classes:
H01L21/027; G03F7/38
Foreign References:
| JPH08262699A | 1996-10-11 | |||
| JP2002015971A | 2002-01-18 | |||
| JP2003209045A | 2003-07-25 | |||
| JP2009176862A | 2009-08-06 | |||
| JP2009111186A | 2009-05-21 |
Attorney, Agent or Firm:
ITOH, TADAHIKO (JP)
Tadahiko Ito (JP)
Tadahiko Ito (JP)
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