Title:
RESIST REMOVER LIQUID
Document Type and Number:
WIPO Patent Application WO/2015/029277
Kind Code:
A1
Abstract:
Resist films which have altered through dry etching are tenaciously adherent to the coated surfaces and cannot be completely removed with resist remover liquids for removing resist films formed on copper films. Meanwhile, high-removing-power remover liquids for aluminum films corrode copper films. There has been a desire for a resist remover liquid with which resist films that have been altered by a plasma can be removed and which does not substantially corrode the base irrespective of whether the base is a copper film or an aluminum film. The resist remover liquid is characterized by comprising a tertiary alkanolamine, a polar solvent, water, a cyclic amine, and a sugar alcohol. The remover liquid can remove resist films altered by dry etching, and does not substantially corrode the base irrespective of whether the base is a copper film or an aluminum film.
Inventors:
FUCHIGAMI SHINICHIROU
SUZUKI YASUNORI
ARIDOMI AYAKO
KODAMA AKARI
IGARASHI MICHIO
SAKATA TOSHIHIKO
SUZUKI YASUNORI
ARIDOMI AYAKO
KODAMA AKARI
IGARASHI MICHIO
SAKATA TOSHIHIKO
Application Number:
PCT/JP2014/000786
Publication Date:
March 05, 2015
Filing Date:
February 17, 2014
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
G03F7/42; H01L21/027; H01L21/304
Domestic Patent References:
| WO2005043610A1 | 2005-05-12 | |||
| WO2010119753A1 | 2010-10-21 | |||
| WO2010073887A1 | 2010-07-01 | |||
| WO2009051237A1 | 2009-04-23 |
Foreign References:
| US20090203566A1 | 2009-08-13 | |||
| JP2005043873A | 2005-02-17 | |||
| JP2012225959A | 2012-11-15 |
Attorney, Agent or Firm:
HIROKOH, MASAKI (JP)
Hiroyuki Masaki (JP)
Hiroyuki Masaki (JP)
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