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Patent Searching and Data


Title:
RESIST UNDERLAYER FILM-FORMING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2020/017626
Kind Code:
A1
Abstract:
The present invention includes polymers to which groups represented by formula (1) have been added. (In formula (1): Rx, Sy, and Sz are each independently a hydrogen atom or a monovalent organic group; Ry and Rz are each independently a single bond or a divalent organic group; ring Ary and ring Arz are each independently a C4‑20 cyclic alkyl group or a C6‑30 aryl group, and, ring Ary and ring Arz may bond to form a new ring therebetween; ny is an integer from 0 to the maximum number of groups that can be substituted into ring Ary; nz is an integer from 0 to the maximum number of groups that can be substituted into ring Arz; and ※ is a polymer bonding site.)

Inventors:
NISHIMAKI HIROKAZU (JP)
NAKAJIMA MAKOTO (JP)
HASHIMOTO KEISUKE (JP)
Application Number:
PCT/JP2019/028414
Publication Date:
January 23, 2020
Filing Date:
July 19, 2019
Export Citation:
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Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
G03F7/11; C08G8/00; C08G8/20; C08G12/08; C08G12/26; H01L21/027
Domestic Patent References:
WO2015151803A12015-10-08
WO2017199768A12017-11-23
WO2014185335A12014-11-20
Foreign References:
JP2017125890A2017-07-20
Attorney, Agent or Firm:
KURIHARA, Hiroyuki et al. (JP)
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