Title:
RESIST UNDERLAYER FILM FORMING COMPOSITION FOR NANOIMPRINTING
Document Type and Number:
WIPO Patent Application WO/2023/145923
Kind Code:
A1
Abstract:
The present invention provides a resist underlayer film forming composition for nanoimprinting, the resist underlayer film forming composition being capable of forming a film which exhibits good planarization properties, while achieving high hydrophobicity and gas permeability by means of firing, and which has improved adhesion to a hydrophobic upper film; and this resist underlayer film forming composition for nanoimprinting is capable of adjusting the optical constants or the etching rate thereof by altering the molecular skeleton of a resin so as to adapt to a process. The present invention provides a resist underlayer film forming composition for nanoimprinting, the resist underlayer film forming composition containing an organic solvent and a compound that has an aromatic ring. If films are formed by firing this composition at the same temperature in the ambient atmosphere and in a nitrogen atmosphere, the difference between the contact angles with pure water of these films is 26 degrees or less.
Inventors:
TOKUNAGA HIKARU (JP)
NAKAJIMA MAKOTO (JP)
NISHIMAKI HIROKAZU (JP)
NAKAJIMA MAKOTO (JP)
NISHIMAKI HIROKAZU (JP)
Application Number:
PCT/JP2023/002799
Publication Date:
August 03, 2023
Filing Date:
January 30, 2023
Export Citation:
Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
C08G8/00; B29C59/02; C08G12/00; C08G14/00; H01L21/027
Domestic Patent References:
| WO2020162183A1 | 2020-08-13 |
Foreign References:
| JP2020166043A | 2020-10-08 | |||
| JP2017021337A | 2017-01-26 | |||
| JP2016206676A | 2016-12-08 |
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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