Title:
RESONANCE DEVICE AND RESONANCE DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/066126
Kind Code:
A1
Abstract:
Provided are a resonance device and a resonance device manufacturing method which enable improvement of bond strength and airtightness of joining parts. A resonance device 1 is provided with: a MEMS substrate 50 including a resonator 10; an upper lid 30; and a joining part 60 for joining the upper lid 30 and the MEMS substrate 50 so as to seal a vibration space of the resonator 10. The joining part 60 includes a eutectic layer 65 containing, as the main component, a eutectic alloy of: a first metal containing aluminum as the main component; a second metal which is germanium or silicon; and a third metal which is titanium or nickel.
Inventors:
DEHARA KENTAROU (JP)
FUKUMITSU MASAKAZU (JP)
FUKUMITSU MASAKAZU (JP)
Application Number:
PCT/JP2019/021055
Publication Date:
April 02, 2020
Filing Date:
May 28, 2019
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/02; H03H3/007; H03H9/24
Domestic Patent References:
| WO2017047663A1 | 2017-03-23 |
Foreign References:
| JP2013052449A | 2013-03-21 | |||
| JP2013248657A | 2013-12-12 | |||
| JP2016041434A | 2016-03-31 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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