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Patent Searching and Data


Title:
RESONANCE DEVICE AND RESONANCE DEVICE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2020/194810
Kind Code:
A1
Abstract:
Provided are: a resonance device in which it is possible to minimize loss of vacuum within a vibration space of a resonator; and a production method for such a resonance device. This resonance device 1 is provided with: a MEMS substrate 50 that includes a resonator 10; an upper lid 30 that includes a silicon oxide film L31 in a surface facing the MEMS substrate 50; and a joint part 60 which joins the MEMS substrate 50 and the upper lid 30 in such a manner as to seal the vibration space of the resonator 10. The silicon oxide film L31 is formed in a part of the area surrounding the vibration space when the upper lid 30 is viewed in a planar view, and includes a through-hole TH1 that penetrates the film and reaches the rear surface of the upper lid 30. The through-hole TH1 includes a first metal layer 80.

Inventors:
FUKUMITSU MASAKAZU (JP)
HIGUCHI YOSHIYUKI (JP)
Application Number:
PCT/JP2019/040421
Publication Date:
October 01, 2020
Filing Date:
October 15, 2019
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/24; H03H3/007
Domestic Patent References:
WO2017047663A12017-03-23
WO2017212677A12017-12-14
WO2015098679A12015-07-02
Foreign References:
JP2011061416A2011-03-24
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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