Title:
RF MODULE AND PRODUCTION METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2004/100625
Kind Code:
A1
Abstract:
A first two-dimensional circuit (1) as a two-dimensional circuit is produced by forming a ceramic-material insulation film (12) on a thick metal base (11) by an aerosol-deposition method and mounting a pattern wiring (13) and existing chip components thereon, and, on this first two-dimensional circuit (1), a second two-dimensional circuit (2) as a two-dimensional circuit produced by forming an insulation film (22) on a thin metal base (12) and mounting a pattern wiring (23) and existing chip components thereon and a third two-dimensional circuit (3) produced by forming an insulation film (32) on a thin metal base (31) and mounting thereon a pattern wiring (33) and comparatively large existing chip components that cannot be mounted in a module, are layered to produce an integrated RF module.
Inventors:
TSURUMI TAKAAKI (JP)
AKEDO JUN (JP)
NAM SANG-MIN (JP)
AKEDO JUN (JP)
NAM SANG-MIN (JP)
Application Number:
PCT/JP2004/003748
Publication Date:
November 18, 2004
Filing Date:
March 19, 2004
Export Citation:
Assignee:
NAT INST OF ADVANCED IND SCIEN (JP)
TSURUMI TAKAAKI (JP)
AKEDO JUN (JP)
NAM SANG-MIN (JP)
TSURUMI TAKAAKI (JP)
AKEDO JUN (JP)
NAM SANG-MIN (JP)
International Classes:
H01L21/48; H05K1/18; H05K1/05; H05K3/46; (IPC1-7): H05K1/05; H05K3/44
Domestic Patent References:
| WO2002034966A1 | 2002-05-02 |
Foreign References:
| JP2000124568A | 2000-04-28 | |||
| JP2003218269A | 2003-07-31 | |||
| JPH06164088A | 1994-06-10 | |||
| JP2002190512A | 2002-07-05 |
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