Title:
RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2023/003266
Kind Code:
A1
Abstract:
According to various embodiments, a rigid flexible printed circuit board may comprise: a first base conductive layer; a first rigid conductive layer spaced apart from the first base conductive layer in a first direction; a second rigid conductive layer spaced apart from the first base conductive layer in the first direction and spaced apart from the first rigid conductive layer in a second direction crossing the first direction; a base cover layer spaced apart from the first base conductive layer in the first direction and positioned closer to the first base conductive layer than the first rigid conductive layer and the second rigid conductive layer; a transmission line positioned between the first base conductive layer and the base cover layer; and a dummy metal layer disposed at the base cover layer, positioned between the first rigid conductive layer and the second rigid conductive layer, and overlapping the transmission line in the first direction. Various other embodiments are also possible.
Inventors:
HONG EUNSEOK (KR)
Application Number:
PCT/KR2022/010256
Publication Date:
January 26, 2023
Filing Date:
July 14, 2022
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K3/46; H05K1/02; H05K1/11
Foreign References:
| KR20210081968A | 2021-07-02 | |||
| KR20190101826A | 2019-09-02 | |||
| KR100666224B1 | 2007-01-09 | |||
| KR20170140691A | 2017-12-21 | |||
| JPH07263911A | 1995-10-13 |
Attorney, Agent or Firm:
MUHANN PATENT & LAW FIRM (KR)
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