Title:
RING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/162768
Kind Code:
A1
Abstract:
In the present invention, a ring device (10) comprises a cylindrical ring body (20), a membranous magnetic body (40) arranged outside an outer peripheral surface (23) of the ring body (20), and a wound coil conductor (30) arranged outside the outer peripheral surface (23). A base conductor is provided on the outer peripheral surface (23) of the ring body (20). At least some of the magnetic body (40) has a portion arranged between the coil conductor (30) and the base conductor of the outer peripheral surface (23).
Inventors:
KUBO HIROYUKI (JP)
Application Number:
PCT/JP2023/004899
Publication Date:
August 31, 2023
Filing Date:
February 14, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01Q7/00
Domestic Patent References:
| WO2020175659A1 | 2020-09-03 |
Foreign References:
| JP2018148452A | 2018-09-20 | |||
| US20170277990A1 | 2017-09-28 | |||
| US20190181544A1 | 2019-06-13 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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