Title:
ROTIGOTINE-CONTAINING ADHESIVE PATCH
Document Type and Number:
WIPO Patent Application WO/2023/157865
Kind Code:
A1
Abstract:
A rotigotine-containing adhesive patch which comprises a support layer and a pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer contains at least one compound selected from the group consisting of rotigotine and pharmacologically acceptable salts of rotigotine, characterized in that the pressure-sensitive adhesive layer further contains a pressure-sensitive adhesive base and at least one compound selected from the group consisting of thioglycolic acid and pharmacologically acceptable salts of thioglycolic acid.
Inventors:
KAWAI KIMIKO (JP)
SHINODA TOMOHIRO (JP)
KUROKAWA TAKAO (JP)
SHINODA TOMOHIRO (JP)
KUROKAWA TAKAO (JP)
Application Number:
PCT/JP2023/005160
Publication Date:
August 24, 2023
Filing Date:
February 15, 2023
Export Citation:
Assignee:
HISAMITSU PHARMACEUTICAL CO (JP)
International Classes:
A61K31/381; A61K9/70; A61K47/14; A61K47/20; A61K47/32; A61K47/34; A61P25/00; A61P25/16; A61P43/00
Domestic Patent References:
| WO2017073516A1 | 2017-05-04 |
Foreign References:
| JP2013079220A | 2013-05-02 | |||
| JP2017515871A | 2017-06-15 | |||
| JPS4640350B1 | ||||
| JP2009249295A | 2009-10-29 |
Attorney, Agent or Firm:
CENTCREST IP ATTORNEYS (JP)
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