Title:
ROUGHENED COPPER FOIL, COPPER CLAD LAMINATE AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2019/244541
Kind Code:
A1
Abstract:
[Problem] To provide a roughened copper foil which is capable of significantly improving the heat-resistant peel strength between itself and a thermoplastic resin that has low dielectric constant.
[Solution] A roughened copper foil that has a roughened surface on at least one side, said roughened surface being composed of needle-like crystals and/or plate-like crystals, which contain cuprous oxide and/or copper oxide. With respect to this roughened copper foil, the roughened surface has a cuprous oxide thickness of 71-300 nm as determined by sequential electrochemical reduction analysis (SERA) and a copper oxide thickness of 0-20 nm as determined by sequential electrochemical reduction analysis (SERA).
Inventors:
HOSOKAWA MAKOTO (JP)
Application Number:
PCT/JP2019/020038
Publication Date:
December 26, 2019
Filing Date:
May 21, 2019
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C23C22/63; B32B15/08; C23C22/78; C23C26/00; H05K1/09
Domestic Patent References:
| WO2017056534A1 | 2017-04-06 | |||
| WO2017150043A1 | 2017-09-08 |
Attorney, Agent or Firm:
ISSHIKI & CO. (JP)
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