Title:
ROUGHENED COPPER FOIL, COPPER FOIL WITH CARRIER, COPPER-CLAD LAMINATE AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/182177
Kind Code:
A1
Abstract:
The present invention provides a roughened copper foil which can have both high adhesion to a thermoplastic resin and excellent high-frequency characteristics at the same time. This roughened copper foil has a roughened surface on at least one side thereof. The roughened surface has a skewness Ssk of more than 0.35. The roughened surface has a plurality of roughening particles; and the volume of the roughening particles per 1 µm2 is 0.11 µm3 to 0.25 µm3. The Ssk is a value that is measured in accordance with JIS B0681-2 (2018) at a cutoff wavelength of 1.0 μm using an L-filter without performing cutoff using an S-filter. The volume of the roughening particles per 1 µm2 is a value that is calculated by three-dimensional analysis of an image of the roughened surface obtained with use of FIB-SEM.
Inventors:
NAKAJIMA DAISUKE (JP)
KURIHARA NAKAGAWA MIHO (JP)
TASAKA CHISATO (JP)
KAWAGUCHI SHOTA (JP)
KON AKIE (JP)
KURIHARA NAKAGAWA MIHO (JP)
TASAKA CHISATO (JP)
KAWAGUCHI SHOTA (JP)
KON AKIE (JP)
Application Number:
PCT/JP2023/010439
Publication Date:
September 28, 2023
Filing Date:
March 16, 2023
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO LTD (JP)
International Classes:
C25D7/06; C25D1/04; C25D5/16; H05K1/09
Domestic Patent References:
| WO2021193246A1 | 2021-09-30 | |||
| WO2022255420A1 | 2022-12-08 |
Foreign References:
| JP2013199082A | 2013-10-03 | |||
| JP2011219789A | 2011-11-04 | |||
| JP2011219790A | 2011-11-04 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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