RTM MOLDING DEVICE, RTM MOLDING METHOD, AND SEMI-MOLDED BODY

WIPO Patent Application WO/2012/117869

A1

The objective is to provide an RTM molding device and an RTM molding method by which even a large member and a thick plate member can be impregnated with a resin without causing non-impregnation, fiber meandering, etc., and a high-toughness and high-precise molded body can be obtained. In an RTM molding device (100), a fiber-reinforced base material (11) is provided on at least one side surface thereof with: a surface molding layer (4) which is arranged between the fiber-reinforced base material (11) and a molding die (1), comprises a plurality of through holes (7) formed therein, and has a stiffness so that when the inside of the cavity is depressurized, the thickness does not substantially change under the pressure in a cavity; and a resin diffusion portion (5) which is located on the side of the surface molding layer (4) opposite to the side of the fiber-reinforced base material (11), and comprises a resin flow path formed to communicate with the plurality of through holes (7) of the surface molding layer (4).

JPH07156166	RESIN MOLDED PRODUCT AND PRODUCTION THEREOF
JP2003124143	METHOD AND MOLD FOR FORMING PATTERN, SEMICONDUCTOR DEVICE, ELECTRICAL CIRCUIT, DISPLAYING BODY MODULE, COLOR FILTER, AND LIGHT-EMITTING DEVICE

HAYASHI NORIYA (JP)
KANEMASU MASAYUKI (JP)

PCT/JP2012/053798

September 07, 2012

February 17, 2012

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MITSUBISHI HEAVY IND LTD (JP)
HAYASHI NORIYA (JP)
KANEMASU MASAYUKI (JP)

B29C39/10; B29K105/08

JP2004181627A	2004-07-02
JP2008036997A	2008-02-21
JP2008290441A	2008-12-04

See also references of EP 2682247A4
None

FUJITA, Takaharu et al. (JP)
Takaharu Fujita (JP)

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