Title:
RUBBER BAND MANUFACTURING METHOD, RUBBER BAND, AND ELECTRONIC APPARATUS TO BE ATTACHED TO HUMAN BODY
Document Type and Number:
WIPO Patent Application WO/2019/221199
Kind Code:
A1
Abstract:
Provided is an improved rubber band for attaching an electronic apparatus body to a body. This method of manufacturing a rubber band 10 comprises: inserting a resin plate having a plurality of resin holes 5d between an outer-surface mold 8a and a back mold 8b to form a first outer-skin portion 6a on an upper surface 5A of the resin plate, and then inserting the resin plate with the first outer-skin portion 6a formed thereon between the outer-surface mold 8a and an inner-surface mold 8b to form a second outer-skin portion 6b on a back surface 5B of the resin plate.
Inventors:
KAWAGUCHI ASEI WILLIAM (JP)
Application Number:
PCT/JP2019/019385
Publication Date:
November 21, 2019
Filing Date:
May 15, 2019
Export Citation:
Assignee:
SEKISUI POLYMATECH CO LTD (JP)
International Classes:
A44C5/02; A44C5/00; A61B5/0245
Foreign References:
| JPH07329110A | 1995-12-19 | |||
| JP2012135659A | 2012-07-19 | |||
| JPH05137608A | 1993-06-01 | |||
| JP2011072777A | 2011-04-14 |
Other References:
See also references of EP 3795028A4
Attorney, Agent or Firm:
OHTAKE Seigo (JP)
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